报告题目：大规模脑微观影像中的几何建模和形态分析

Title: Geometric Modeling and Morphological Analysis for Connectomics from Large-Scale Electron Microscopy Images

报告摘要：实现突触级分辨率的神经元连接图谱高精度重建是解析脑功能机制的关键手段。随着连续电镜成像技术的发展，大规模神经连接组学研究已进入PB级数据时代。基于电镜的连接组学也被评为《自然方法》年度方法。然而，脑中数万神经元分布稠密、形态复杂，单神经元空间跨度大，从大规模电镜图像中完整重建神经元的三维精细结构面临巨大挑战。本报告将汇报我们结合神经元几何形态和电镜图像特征，在大规模电镜图像中进行神经元的精细重建、高效追踪、形态分析方面的研究工作和最新进展。

Abstract:

High-precision reconstruction of neuronal connectivity maps at the synaptic level is a key way to understand how the brain works. With the development of serial electron microscopy imaging, large-scale connectomics research has entered the era of petabyte-scale data. However, even a small volume of brain has tens of thousands of densely distributed neurons with complex shapes, and individual neurons can span large areas, making it extremely challenging to fully reconstruct their 3D fine structures from large-scale EM images. In this talk, I will share our work and latest progress on fine 3D reconstruction of neurons and their morphological analysis in large-scale EM images.

报告人：陈雪锦

报告人简介：

陈雪锦，中国科学技术大学信息学院教授，少年班学院副院长。分别于中国科学技术大学获得学士和博士学位，耶鲁大学计算机系博士后，曾于斯坦福大学、微软亚洲研究院任访问学者。主要研究方向为计算机图形学、三维视觉、脑显微影像分析。在ACM TOG、TMI、ICCV、ICML等期刊/会议上发表学术论文100余篇，曾获CVM期刊年度最佳论文提名、GDC、3DMM会议最佳论文、ISBI挑战赛第一名等奖励。获国家教学成果二等奖、安徽省教学成果特等奖、CSIG“石青云女科学家奖”。

Xuejin Chen is currently a full professor with the School of Information Science and Technology, University of Science and Technology of China. She received the B.S. and Ph.D. degrees from University of Science and Technology of China. She conducted research as a postdoctoral scholar with the Department of Computer Science in Yale University. She also visited Stanford University and Microsoft Research Asia in 2017 and 2015 respectively. Her research interests include 3D modeling, geometry processing, and biomedical image analysis. She has authored or co-authored over 90 articles (including ACM TOG, IEEE TMM, ACM SIGGRAPH, ICCV, NeurIPS). She was one recipient of the Honorable Mention Awards of Computational Visual Media in 2019, GDC 2022, 3DMM 2024 and the first prize of XPRESS challenge in ISBI 2023. She also serves as Associate Editor of IEEE Trans TIP, and served as TPC members of Siggraph Asia and Area chair of ICCV, ECCV.

时间：2026年09月09日 14:00-15:15

地点：云谷校区 学术环E10-217

【在线参加】：腾讯会议  759-876-735